No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges.Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include input and output matching, high gain and thermally-enhanced package with earless flange. Manufactured with Infineon’s advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTFB193404F Package H- |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges. PTFB211501E Package H-36248-2 PTFB211501F Package H-37248-2 ACP (dBc) Drain Efficiency (%) Single-carrier WCDMA Drive Up VDD = 3 |
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Infineon Technologies AG |
LDMOS RF Power Field Effect Transistor 90 W/ 869-960 MHz • • Broadband internal matching Typical EDGE performance - Average output power = 45 W - Gain = 18 dB - Efficiency = 40% Typical CW performance - Output power at P –1dB = 120 W - Gain = 17 dB - Efficiency = 60% Integrated ESD protection: Human Body Mo |
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Infineon Technologies AG |
LDMOS RF Power Field Effect Transistor 130 W/ 2110-2170 MHz • • Broadband internal matching Typical two –carrier WCDMA performance at 2140 MHz - Average output power = 28 W - Linear Gain = 13.5 dB - Efficiency = 25% - Intermodulation distortion = –37 dBc - Adjacent channel power = –42 dBc Typical CW performanc |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FET include a thermally-enhanced package with earless flange. Manufactured with Infineon's advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTFC262157FH Package H-34288G-4/2 Gain (dB) Drain Efficiency |
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Infineon Technologies |
Thermally-Enhanced High Power RF LDMOS FETs include input and output matching, high gain, wide signal bandwidth and reduced memory effects for improved DPD correctability. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reli |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include input matching and thermallyenhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA080551E Package H-36265-2 P |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FET include input and output matching, and thermally-enhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA210701E Packag |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include input and output matching, high gain, wide signal bandwidth and reduced memory effects for unparalleled DPD correctability. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FET include input and output matching, high gain and thermally-enhanced packages with earless flanges. Manufactured with Infineon's advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTFB210801FA Package |
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Infineon |
High Power RF LDMOS Field Effect Transistor • Broadband internal matching • Typical CW performance, 28 V, single side - Output power, P1dB = 70 W - Efficiency = 56% • Integrated ESD protection • Excellent thermal stability • Capable of handling 10:1 VSWR @ 28 V, 70 W (CW) output power, pe |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges.Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. |
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Infineon Technologies AG |
LDMOS RF Power Field Effect Transistor 45 W/ 869-960 MHz • • Broadband internal matching Typical EDGE performance - Average output power = 22.5 W - Gain = 18 dB - Efficiency = 40% Typical CW performance - Output power at P –1dB = 60 W - Gain = 17 dB - Efficiency = 60% Integrated ESD protection: Human Body M |
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Infineon Technologies AG |
LDMOS RF Power Field Effect Transistor 90 W/ 2110-2170 MHz • • Internal matching for wideband performance Typical two –carrier 3GPP WCDMA performance - Average output power = 19 W at –37 dBc - Efficiency = 25% Typical CW performance - Output power at P –1dB = 105 W - Gain = 15 dB - Efficiency = 53% Integrated |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs • • Broadband internal matching Typical two-carrier WCDMA performance at 770 MHz, 30 V - Average output power = 40 W - Linear Gain = 19 dB - Efficiency = 25% - Intermodulation distortion = –39 dBc Typical CW performance, 770 MHz, 30 V - Output power |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs internal I/O matching and thermally-enhanced open cavity ceramic package. Manufactured with Infineon's advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTFA091503EL Package H-33288-6 Features VDD = |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FET • Thermally-enhanced packaging, Pb-free and RoHS-compliant • Broadband internal matching • Typical two-carrier WCDMA performance at 2140 MHz, 28 V - Average output power = 33 dBm - Linear Gain = 16.5 dB - Intermodulation distortion = –50 dBc - Adjace |
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Infineon |
High Power RF LDMOS Field Effect Transistor • Typical two-carrier WCDMA performance, 8 dB PAR - POUT = 33 dBm Avg - ACPR = –40 dBc • Typical CW performance, 940 MHz, 28 V - POUT = 40 dBm - Efficiency = 59% - Gain = 20 dB • Typical CW performance, 2140 MHz, 28 V - POUT = 40 dBm - Efficiency |
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Infineon |
Thermally-Enhanced High Power RF LDMOS FETs include input and output matching, high gain, wide signal bandwidth and reduced memory effects for unparalleled DPD correctability. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior |
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