No. | parte # | Fabricante | Descripción | Hoja de Datos |
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NXP |
RF Power LDMOS Transistors D G Mirror pinout versions (A and B) to simplify use in a push--pull, two--up configuration S Characterized from 30 to 50 V Suitable for linear application Integrated ESD protection with greater negative gate--source voltage range for |
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NXP |
RF Power LDMOS Transistors Unmatched Input and Output Allowing Wide Frequency Range Utilization Device can be used Single--Ended or in a Push--Pull Configuration Qualified up to a Maximum of 50 VDD Operation Characterized from 30 to 50 V for Extended Power Range Sui |
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NXP |
RF Power Field Effect Transistor • 100% PAR Tested for Guaranteed Output Power Capability • Characterized with Series Equivalent Large--Signal Impedance Parameters and Common Source S--Parameters • Internally Matched for Ease of Use • Integrated ESD Protection • Greater Negative Gat |
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NXP |
RF Power LDMOS Transistors Characterized with Series Equivalent Large--Signal Impedance Parameters Internally Matched for Ease of Use Qualified up to a Maximum of 50 VDD Operation Integrated ESD Protection Greater Negative Gate--Source Voltage Range for Improved Clas |
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NXP |
RF Power FET • Characterized with Series Equivalent Large--Signal Impedance Parameters • Qualified Up to a Maximum of 50 VDD Operation • Integrated ESD Protection • 225°C Capable Plastic Package • RoHS Compliant • In Tape and Reel. R1 Suffix = 500 Units per 44 mm |
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NXP |
RF Power FET • Characterized with Series Equivalent Large--Signal Impedance Parameters • CW Operation Capability with Adequate Cooling • Qualified Up to a Maximum of 50 VDD Operation • Integrated ESD Protection • Designed for Push--Pull Operation • Greater Negati |
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NXP |
RF Power LDMOS Transistors Wide operating frequency range Extreme ruggedness Unmatched, capable of very broadband operation Integrated stability enhancements Low thermal resistance Extended ESD protection circuit 2012, 2019 NXP B.V. RF Device Data NXP Semiconduc |
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NXP |
RF Power Field Effect Transistors • Internally Matched for Ease of Use • High Gain, High Efficiency and High Linearity • Integrated ESD Protection • Designed for Maximum Gain and Insertion Phase Flatness • Excellent Thermal Stability • Characterized with Series Equivalent Large - Si |
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NXP |
RF Power LDMOS Transistor • Characterized with series equivalent large--signal impedance parameters • Internally matched for ease of use • Qualified for operation at 32 Vdc • Integrated ESD prote |
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NXP |
RF Power Field Effect Transistors • Internally Matched for Ease of Use • High Gain, High Efficiency and High Linearity • Integrated ESD Protection • Designed for Maximum Gain and Insertion Phase Flatness • Excellent Thermal Stability • Characterized with Series Equivalent Large - Si |
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NXP |
RF Power LDMOS Transistors Characterized with Series Equivalent Large--Signal Impedance Parameters Internally Matched for Ease of Use Qualified up to a Maximum of 50 VDD Operation Integrated ESD Protection Greater Negative Gate--Source Voltage Range for Improved Clas |
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NXP |
RF Power GaN Transistors Advanced GaN on SiC, for optimal thermal performance Characterized for CW, long pulse (up to several seconds) and short pulse operations Device can be used in a single--ended or push--pull configuration Input matched for simplified input circ |
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NXP |
RF Power FET • Characterized with Series Equivalent Large--Signal Impedance Parameters • Internally Input Matched for Ease of Use • Qualified Up to a Maximum of 50 VDD Operation • Integrated ESD Protection • Designed for Push--Pull Operation • Greater Negative Ga |
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NXP |
RF Power GaN Transistor • Advanced GaN on SiC, offering high power density • Decade bandwidth performance • Enhanced thermal resistance packaging • Input matched for extended wideband performance • High ruggedness: > 20:1 VSWR Typical Applications • Ideal for military end− |
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NXP |
RF Power LDMOS Transistors Internally input pre--matched for ease of us |
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NXP |
RF Power LDMOS Transistors Internally input pre--matched for ease of us |
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NXP |
RF Power LDMOS Transistors Wide operating frequency range Extreme ruggedness Unmatched, capable of very broadband operation Integrated stability enhancements Low thermal resistance Extended ESD protection circuit 2012, 2019 NXP B.V. RF Device Data NXP Semiconduc |
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NXP |
RF Power LDMOS Transistors D G Mirror pinout versions (A and B) to simplify use in a push--pull, two--up configuration S Characterized from 30 to 50 V Suitable for linear application Integrated ESD protection with greater negative gate--source voltage range for |
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NXP |
RF Power GaN Transistor |
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NXP |
RF Power Field Effect Transistors |
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