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NXP MRF DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
MRF300AN

NXP
RF Power LDMOS Transistors
D G
 Mirror pinout versions (A and B) to simplify use in a push--pull, two--up configuration S
 Characterized from 30 to 50 V
 Suitable for linear application
 Integrated ESD protection with greater negative gate--source voltage range for
Datasheet
2
MRFE6VP61K25N

NXP
RF Power LDMOS Transistors

 Unmatched Input and Output Allowing Wide Frequency Range Utilization
 Device can be used Single--Ended or in a Push--Pull Configuration
 Qualified up to a Maximum of 50 VDD Operation
 Characterized from 30 to 50 V for Extended Power Range
 Sui
Datasheet
3
MRF8S9200NR3

NXP
RF Power Field Effect Transistor

• 100% PAR Tested for Guaranteed Output Power Capability
• Characterized with Series Equivalent Large--Signal Impedance Parameters and Common Source S--Parameters
• Internally Matched for Ease of Use
• Integrated ESD Protection
• Greater Negative Gat
Datasheet
4
MRF6V12500H

NXP
RF Power LDMOS Transistors

 Characterized with Series Equivalent Large--Signal Impedance Parameters
 Internally Matched for Ease of Use
 Qualified up to a Maximum of 50 VDD Operation
 Integrated ESD Protection
 Greater Negative Gate--Source Voltage Range for Improved Clas
Datasheet
5
MRF6V2300NBR1

NXP
RF Power FET

• Characterized with Series Equivalent Large--Signal Impedance Parameters
• Qualified Up to a Maximum of 50 VDD Operation
• Integrated ESD Protection
• 225°C Capable Plastic Package
• RoHS Compliant
• In Tape and Reel. R1 Suffix = 500 Units per 44 mm
Datasheet
6
MRF6VP11KGSR5

NXP
RF Power FET

• Characterized with Series Equivalent Large--Signal Impedance Parameters
• CW Operation Capability with Adequate Cooling
• Qualified Up to a Maximum of 50 VDD Operation
• Integrated ESD Protection
• Designed for Push--Pull Operation
• Greater Negati
Datasheet
7
MRFE6VS25NR1

NXP
RF Power LDMOS Transistors

 Wide operating frequency range
 Extreme ruggedness
 Unmatched, capable of very broadband operation
 Integrated stability enhancements
 Low thermal resistance
 Extended ESD protection circuit  2012, 2019 NXP B.V. RF Device Data NXP Semiconduc
Datasheet
8
MRF21060LSR3

NXP
RF Power Field Effect Transistors

• Internally Matched for Ease of Use
• High Gain, High Efficiency and High Linearity
• Integrated ESD Protection
• Designed for Maximum Gain and Insertion Phase Flatness
• Excellent Thermal Stability
• Characterized with Series Equivalent Large - Si
Datasheet
9
MRF24300N

NXP
RF Power LDMOS Transistor

• Characterized with series equivalent large--signal impedance parameters
• Internally matched for ease of use
• Qualified for operation at 32 Vdc
• Integrated ESD prote
Datasheet
10
MRF21060LR3

NXP
RF Power Field Effect Transistors

• Internally Matched for Ease of Use
• High Gain, High Efficiency and High Linearity
• Integrated ESD Protection
• Designed for Maximum Gain and Insertion Phase Flatness
• Excellent Thermal Stability
• Characterized with Series Equivalent Large - Si
Datasheet
11
MRF6V12500GS

NXP
RF Power LDMOS Transistors

 Characterized with Series Equivalent Large--Signal Impedance Parameters
 Internally Matched for Ease of Use
 Qualified up to a Maximum of 50 VDD Operation
 Integrated ESD Protection
 Greater Negative Gate--Source Voltage Range for Improved Clas
Datasheet
12
MRF24G300H

NXP
RF Power GaN Transistors

 Advanced GaN on SiC, for optimal thermal performance
 Characterized for CW, long pulse (up to several seconds) and short pulse operations
 Device can be used in a single--ended or push--pull configuration
 Input matched for simplified input circ
Datasheet
13
MRF6VP3450HR5

NXP
RF Power FET

• Characterized with Series Equivalent Large--Signal Impedance Parameters
• Internally Input Matched for Ease of Use
• Qualified Up to a Maximum of 50 VDD Operation
• Integrated ESD Protection
• Designed for Push--Pull Operation
• Greater Negative Ga
Datasheet
14
MMRF5018HS

NXP
RF Power GaN Transistor

• Advanced GaN on SiC, offering high power density
• Decade bandwidth performance
• Enhanced thermal resistance packaging
• Input matched for extended wideband performance
• High ruggedness: > 20:1 VSWR Typical Applications
• Ideal for military end−
Datasheet
15
MRF13750H

NXP
RF Power LDMOS Transistors

 Internally input pre--matched for ease of us
Datasheet
16
MRF13750HS

NXP
RF Power LDMOS Transistors

 Internally input pre--matched for ease of us
Datasheet
17
MRFE6VS25GNR1

NXP
RF Power LDMOS Transistors

 Wide operating frequency range
 Extreme ruggedness
 Unmatched, capable of very broadband operation
 Integrated stability enhancements
 Low thermal resistance
 Extended ESD protection circuit  2012, 2019 NXP B.V. RF Device Data NXP Semiconduc
Datasheet
18
MRF300BN

NXP
RF Power LDMOS Transistors
D G
 Mirror pinout versions (A and B) to simplify use in a push--pull, two--up configuration S
 Characterized from 30 to 50 V
 Suitable for linear application
 Integrated ESD protection with greater negative gate--source voltage range for
Datasheet
19
MMRF5017HS

NXP
RF Power GaN Transistor
Datasheet
20
MRF8S21140HR3

NXP
RF Power Field Effect Transistors
Datasheet



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