No. | parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
|
|
Samsung Electronics |
64Mb H-die SDRAM • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Four banks operation • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) • All |
|
|
|
Samsung Electronics |
128M-bit SDRAM • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Four banks operation • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) • All |
|
|
|
Samsung Electronics |
256Mb H-Die SDRAM • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Four banks operation • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) • All |
|
|
|
Samsung Electronics |
SDRAM stacked 1Gb D-die ....................................................................................................................................... 4 2.0 General Description......................................................................................... |
|
|
|
Samsung Electronics |
SDRAM stacked 1Gb D-die ....................................................................................................................................... 4 2.0 General Description......................................................................................... |
|