No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Inchange Semiconductor |
N-Channel MOSFET Transistor ·Drain Current : ID= 90A@ TC=25℃ ·Drain Source Voltage : VDSS= 80V(Min) ·Static Drain-Source On-Resistance : RDS(on) = 7.9mΩ(Max) @ VGS= 10V ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation D |
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Analog Devices |
Maximum Offset Voltage Op Amp Low offset voltage: 130 μV max Input offset drift: 1.5 μV/°C max Low noise: 0.25 μV p-p High gain, CMRR and PSRR: 115 dB min Low supply current: 1.1 mA Wide supply voltage range: ±4 V to ±18 V operation APPLICATIONS Medical and industrial instrumenta |
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Fuji Electric |
HIGH VOLTAGE SCHOTTKY BARRIER DIODE High voltage Low VF Super high speed switching High reliability by planer design 28min 7 . 5 ±0 . 2 28min Molding resin : Epoxy resin UL:V-0 Marking Applications High speed switching 867-12 Type name Voltage class Cathode mark Lot No. (Month) |
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INCHANGE |
N-Channel MOSFET ·With To-252(DPAK) package ·Low input capacitance and gate charge ·Low gate input resistance ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·APPLICATIONS ·Switching applications ·ABSOLUTE M |
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Inchange Semiconductor |
Power Transistor CONDITIONS V(BR)CEO Collector-Emitter Breakdown Voltage IC=25mA, RBE= ∞ V(BR)EBO Emitter-Base Breakdown Voltage IE= 5mA , IC= 0 VCE(sat)-1 Collector-Emitter Saturation Voltage IC= 1.5A, IB=3mA VCE(sat)-2 Collector-Emitter Saturation Voltage IC= |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance - Reduced drive requireme |
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INCHANGE |
NPN Transistor ess otherwise specified SYMBOL PARAMETER CONDITIONS VEBO Emitter-Base Breakdown Voltage IE= 200mA; IC= 0 VCE(sat) Collector-Emitter Saturation Voltage IC= 2A; IB= 0.6A VBE(sat) Base-Emitter Saturation Voltage IC= 2A; IB= 0.6A ICBO Collecto |
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INCHANGE |
N-Channel MOSFET ·Static drain-source on-resistance: RDS(on)≤22.5mΩ ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·DESCRITION ·DC-DC Conversion ·Inverters ·ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAME |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance - Reduced drive requireme |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching -Independent of temperature • Voltage controlled - High transconductance • Low. input capacitance - Reduced drive requireme |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance - Reduced drive requireme |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching -Independent of temperature • Voltage controlled - High transconductance • Low. input capacitance - Reduced drive requireme |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance - Reduced drive requireme |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance ---.,. Reduced drive requ |
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Temic |
(BUD86 / BUD87) Silicon NPN High Voltage Switching Transistor |
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GE |
FIELD EFFECT POWER TRANSISTOR • Polysilicon gate - Improved stability and reliability • No secondary breakdown - Excellent ruggedness • Ultra-fast switching - Independent of temperature • Voltage controlled - High transconductance • Low input capacitance - Reduced drive requ |
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Inchange Semiconductor |
Power Transistor se-Emitter On Voltage IC= 2A; IB= 0.4A IC= 2A; VCE= 10V ICEO Collector Cutoff Current VCE= 150V; IB= 0 ICES Collector Cutoff Current VCE= 350V; VBE= 0 IEBO Emitter Cutoff Current VEB= 5V; IC= 0 hFE-1 DC Current Gain IC= 0.3A; VCE= 10V h |
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Rohm |
Boost DC/DC Charger CP/CV Charging Charge-On/ Off control available with EN pin Integrated Input Detection (VBUSOK) Integrated Power Good Boost Switching Topology Low Ron integrated MOSFET Output Short Circuit Protection 0.4mm pitch Chip Scale Package (U |
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Fuji Electric |
HIGH VOLTAGE SCHOTTKY BARRIER DIODE High voltage Low VF Super high speed switching High reliability by planer design 28min 7 . 5 ±0 . 2 28min Molding resin : Epoxy resin UL:V-0 Marking Applications High speed switching 867-15 Type name Voltage class Cathode mark Lot No. (Month) |
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Fuji Electric |
HIGH VOLTAGE SCHOTTKY BARRIER DIODE High voltage Low VF Super high speed switching High reliability by planer design 28min 7 . 5 ±0 . 2 28min Molding resin : Epoxy resin UL:V-0 Marking Applications High speed switching 867-20 Type name Voltage class Cathode mark Lot No. (Month) |
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