No. | parte # | Fabricante | Descripción | Hoja de Datos |
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NXP |
Plus differential I2C-bus buffer and benefits • New dI2C-bus buffers offer improved resistance to system noise and ground offset up to 1⁄2 of supply voltage • 2 channel dI2C (differential I2C-bus) to Fm+ single-ended buffer operating up to 1 MHz with 30 mA SDA/SCL drive capability • |
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NXP |
N-channel TrenchPLUS logic level FET and benefits Allows responsive temperature monitoring due to integrated temperature sensor Low conduction losses due to low on-state resistance Q101 compliant 1.3 Applications 12 V and 24 V high power motor drives Automotive and general p |
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NXP |
TrenchPLUS standard level FET s ESD and overvoltage protection s Internal gate resistor s Q101 compliant s On-state resistance 8 mΩ (typ). 1.3 Applications s 12 V loads s Motors, lamps and solenoids. 1.4 Quick reference data s VDSR(CL) = 41 V (typ) s ID ≤ 89 A s RDSon = 8 mΩ (t |
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NXP |
N-channel TrenchPLUS logic level FET and benefits Allows responsive temperature monitoring due to integrated temperature sensor Q101 compliant Electrostatically robust due to integrated protection diodes Low conduction losses due to low on-state resistance 1.3 Applications 1 |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
STARplug • Designed for general purpose supplies up to 50 W • Integrated power switch: – TEA1520: 48 Ω; 650 V – TEA1521: 24 Ω; 650 V – TEA1522: 12 Ω; 650 V – TEA1523: 6.5 Ω; 650 V – TEA1524: 3.4 Ω; 650 V. • Operates from universal AC mains supplies (80 to 276 |
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NXP |
TrenchPLUS standard level FET s ESD and overvoltage protection s Internal gate resistor s Q101 compliant s On-state resistance 5.1 mΩ (typ). 1.3 Applications s 12 V loads s Motors, lamps and solenoids. 1.4 Quick reference data s VDSR(CL) = 41 V (typ) s ID ≤ 147 A s RDSon = 5.1 |
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NXP Semiconductors |
TrenchPLUS standard level FET s Q101 compliant s ESD protection s Integrated temperature sensor s Integrated current sensor. 1.3 Applications s Variable Valve Timing for engines s Automotive and power switching s Electrical Power Assisted Steering s Fan control. 1.4 Quick refer |
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NXP |
Dual TrenchPLUS Logic Level FET and benefits Integrated current sensor Integrated temperature sensor 1.3 Applications Lamp switching Motor drive systems Power distribution Solenoid drivers 1.4 Quick reference data Table 1. Quick reference Conditions VGS = 5 V; ID = 5 |
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NXP Semiconductors |
N-channel TrenchPLUS standard level FET and benefits Allows responsive temperature monitoring due to integrated temperature sensor Electrostatically robust due to integrated protection diodes Low conduction losses due to low on-state resistance Q101 compliant Reduced component co |
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NXP |
Dual TrenchPLUS FET Logic Level FET and benefits Integrated current sensors Integrated temperature sensors 1.3 Applications Lamp switching Motor drive systems Power distribution Solenoid drivers 1.4 Quick reference data Table 1. Symbol RDSon Quick reference data Parameter |
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NXP |
Dual TrenchPLUS FET Logic Level FET and benefits Integrated current sensors Integrated temperature sensors 1.3 Applications Lamp switching Motor drive systems Power distribution Solenoid drivers 1.4 Quick reference data Table 1. Symbol RDSon ID/Isense V(BR)DSS Quick refer |
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NXP |
N-channel TrenchPLUS logic level FET and benefits • AEC-Q101 Compliant • Enables temperature monitoring due to integrated temperature sensor • Enables current sense measurement due to integrated current senseFET • Suitable for thermally demanding environments due to 175 °C rating 3. Ap |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
i.MX 6DualPlus/6QuadPlus Automotive Applications Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Block Diagram . . . . . . . |
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NXP |
Mainstream contactless smart-card-IC and benefits 2 kB or 4 kB EEPROM Simple fixed memory structure compatible with MIFARE Classic 1K and MIFARE Classic 4K Memory structure identical to MIFARE Classic 4K (sectors, blocks) Access conditions freely configurable Supports ISO/IEC |
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NXP |
Mainstream contactless smart-card-IC and benefits 2 kB or 4 kB EEPROM Simple fixed memory structure compatible with MIFARE Classic 1K and MIFARE Classic 4K Memory structure identical to MIFARE Classic 4K (sectors, blocks) Access conditions freely configurable Supports ISO/IEC |
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