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ETC WED DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
WEDPNF8M721V-1012BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
2
WEDPNF8M721V-XBX

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
3
WEDPNF8M721V-1010BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
4
WEDPNF8M721V-1215BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
5
WEDPNF8M721V-1215BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
6
WEDPNF8M721V-1010BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
7
WEDPNF8M721V-1010BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
8
WEDPNF8M721V-1012BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
9
WEDPNF8M721V-1012BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
10
WEDPNF8M721V-1015BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
11
WEDPNF8M721V-1015BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
12
WEDPNF8M721V-1015BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
13
WEDPNF8M721V-1210BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
14
WEDPNF8M721V-1210BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
15
WEDPNF8M721V-1210BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
16
WEDPNF8M721V-1212BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
17
WEDPNF8M721V-1212BI

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
18
WEDPNF8M721V-1212BM

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet
19
WEDPNF8M721V-1215BC

ETC
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 6
Datasheet



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