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ETC MEM DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
TPS51216

Texas Instruments
Memory Power Solution Synchronous Buck Controller
1
•2 Synchronous Buck Controller (VDDQ)
  – Conversion Voltage Range: 3 V to 28 V
  – Output Voltage Range: 0.7 V to 1.8 V
  – 0.8% VREF Accuracy
  – D-CAP™ Mode for Fast Transient Response
  – Selectable 300 kHz/400 kHz Switching Frequencies
  – Optimized Effic
Datasheet
2
FM25640-S

ETC
64Kb FRAM Serial Memory
64K bit Ferroelectric Nonvolatile RAM
• Organized as 8,192 x 8 bits
• High Endurance 1 Trillion (1012) Read/Writes
• 10 Year Data Retention
• NoDelay™ Writes
• Advanced high-reliability ferroelectric process Very Fast Serial Peripheral Interface - SP
Datasheet
3
TMS29F800B

Texas Instruments
FLASH MEMORIES
of Program/Erase Cycle Completion
  – Hardware Method for Detection of Program/Erase Cycle Completion Through Ready/Busy (RY/BY) Output Pin "D High-Speed Data Access at 5-V VCC 10% at Three Temperature Ranges
  – 80 ns Commercial . . . 0°C to 70°C
  – 90 n
Datasheet
4
TMS465409P

Texas Instruments
DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 40, 50, and 60 ns. All inputs and outputs, including clocks, are compatible with LVTTL. All addresses and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibili
Datasheet
5
JBP18S030

Texas Instruments
256-BITS PROGRAMMABLE READ-ONLY MEMORIES
024 PACKAGING INFORMATION Orderable Device JBP18S030MJ Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) NRND CDIP J 16 25 Non-RoHS & Green Lead finish/ Ball material (6) SNPB MSL Peak Temp Op Temp (°C) (3) N / A f
Datasheet
6
HM63921

ETC
2048-word x 9-bit CMOS Parallel In-Out FIFO Memory










• First-in, first-out dual port memory 2 k × 9 organization Low-power CMOS 1.3 micron technology Asynchronous and simultaneous read and write Fully expandable in depth and/or width Single 5 V power supply Empty and full warning flag
Datasheet
7
TMS29LF800T

Texas Instruments
FLASH MEMORIES
of Program/Erase Cycle Completion
  – Hardware Method for Detection of Program/Erase Cycle Completion Through Ready/Busy (RY/BY) Output Pin "D High-Speed Data Access at 3.3-V VCC 10% at Three Temperature Ranges
  – 90 ns Commercial . . . 0°C to 70°C
  – 10
Datasheet
8
TMS28F512A

Texas Instruments
65536 BY 8-BIT FLASH MEMORY
n in temperature ranges of 0°C to 70°C (FML suffix),
  – 40°C to 85°C ( FME suffix), and
  – 40°C to 125°C ( FMQ suffix). TMS28F512A 65536 BY 8-BIT FLASH MEMORY SMJS514C
  – FEBRUARY 1994
  – REVISED AUGUST 1997 FM PACKAGE ( TOP VIEW ) A12 A15 NC VPP VCC W
Datasheet
9
TMS44409P

Texas Instruments
DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 60 ns, 70 ns and 80 ns. Maximum power consumption is as low as 385 mW operating and 6 mW standby. All inputs and outputs, including clocks, are compatible with Series 74 TTL. All addresses and data-in lines are latched
Datasheet
10
TMS664814

Texas Instruments
SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY
ce D Power-Down Mode D Compatible With JEDEC Standards D 16K RAS-Only Refresh (Total for All Banks) D 4K Auto Refresh (Total for All Banks)/64 ms D Automatic Precharge and Controlled Precharge D Burst Interruptions Supported:
  – Read Interruption
  – Wr
Datasheet
11
2N5861

ETC
NPN SILICON ANNULAR MEMORY DRIVER TRANSISTOR
Datasheet
12
AU9360

ETC
USB Multiple Slots Flash Memory Card Reader Controller TRM
………………………………………………………………….. 1 Application Block Diagram…………………………………………………… 3 Pin Assignment…………………………………………………………………. 5 System Architecture and Reference Design………………………………. 9 4.1 AU9360 Block Diagram…………………………………………………… 9 4.2 Sample Schematics……………
Datasheet
13
MEM4X16E43VTW-5

ETC
4 MEG x 16 EDO DRAM

• Single +3.3V ±0.3V power supply
• Industry-standard x16 pinout, timing, functions, and package
• 12 row, 10 column addresses (4) 13 row, 9 column addresses (8)
• High-performance CMOS silicon-gate process
• All inputs, outputs and clocks are LVTTL-
Datasheet
14
81250HG

ETC
NON-VOLATILE MEMORY/NON-VOLATILE RAM
Datasheet
15
CXD8985AQ

ETC
CMOS Video JOG Memory Control
7 IDEC1_HD IDEC1_VD IDEC1_CF IDEC1_PR PIN No. 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 I/O — I I I I I I I — — — O O O O O O O O O O O O — O O O O — O O O O O O — —
Datasheet
16
TMS427409A

Texas Instruments
DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 50, 60, and 70 ns. All address and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibility. DJ/DGA PACKAGES ( TOP VIEW ) VCC DQ1 DQ2 W RAS A11† 1 2 3 4 5 6
Datasheet
17
TPS51216-EP

Texas Instruments
Memory Power Solution Synchronous Buck Controller

•1 Synchronous Buck Controller (VDDQ)
  – Conversion Voltage Range: 3 to 28 V
  – Output Voltage Range: 0.7 to 1.8 V
  – 0.8% VREF Accuracy
  – D-CAP™ Mode for Fast Transient Response
  – Selectable 300-kHz/400-kHz Switching Frequencies
  – Optimized Efficiency
Datasheet
18
74S289

ETC
64BIT RANDOM ACCESS MEMORY
Datasheet
19
L29S800F

ETC
8MEGABIT (1M8 /512K16) 3 VOLT CMOS FLASH MEMERY

• Single 3.0 V read, program, and erase Minimizes system level power requirements
• Compatible with JEDEC-standard commands 2 Uses same software commands as E PROMs
• Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP(I)
• Minimum 100,000
Datasheet
20
FM1608

ETC
64Kb Bytewide FRAM Memory
64K bit Ferroelectric Nonvolatile RAM
• Organized as 8,192 x 8 bits
• High endurance 10 Billion (1010) read/writes
• 10 year data retention at 85° C
• NoDelay™ write
• Advanced high-reliability ferroelectric process Superior to BBSRAM Modules
• No ba
Datasheet



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