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IRF3205S Power MOSFET

IRF3205S

IRF3205S
IRF3205S IRF3205S
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Part Number IRF3205S
Manufacturer International Rectifier
Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use.
Features available for low-profile applications. Absolute Maximum Ratings ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS IAR EAR dv/dt TJ TSTG Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current  Power Dissipation Linear Derating Factor Gate-to-Source Voltage Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt ƒ Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 srew Thermal Resistance RθJC RθJA Parameter Junction-to-Case Junction-to-Ambient (PCB mounted, .
Datasheet Datasheet IRF3205S Data Sheet
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IRF3205S

INCHANGE
IRF3205S
Part Number IRF3205S
Manufacturer INCHANGE
Title N-Channel MOSFET
Description ·Drain Current ID=110A@ TC=25℃ ·Drain Source Voltage : VDSS= 55V(Min) ·Fast Switching Speed ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·APPLICATIONS . ·Designed for high current, high speed switching, switch mode power supplies. ABSOLUTE MAXIMUM RATINGS(T.
Features RAMETER CONDITIONS V(BR)DSS Drain-Source Breakdown Voltage VGS= 0; ID= 250µA VGS(th) Gate Threshold Voltage VDS= VGS; ID=250µA RDS(on) Drain-Source On-Resistance IGSS Gate-Body Leakage Current VGS= 10V; ID=62A VGS= ±20V;VDS= 0 IDSS Zero Gate Voltage Drain Current VDS=55V; VGS= 0 VSD Diode Forward On-Voltage IS=62A ;VGS= 0 MIN TYPE MAX UNIT 55 V 2.0 4.0 V 8 mΩ ±100 nA 25 µ.


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