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| Part Number | 2SD2165 |
| Distributor | Stock | Price | Buy |
|---|
| Part Number | 2SD2165 |
| Manufacturer | NEC |
| Title | NPN Transistor |
| Description | of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full. |
| Features |
a small resin-molded
PACKAGE DRAWING (UNIT: mm)
10.0 ±0.3 4.5 ±0.2
φ 3.2 ±0.2
2.7 ±0.2
15.0 ±0.3
3 ±0.1 4 ±0.2
mounting cost reduction.
FEATURES
• High hFE and low VCE(sat): hFE ≅ 1,300 TYP. (VCE = 5.0 V, IC = 1.0 A) VCE(SAT) ≅ 0.3 V TYP. (IC = 3.0 A, IB = 30 mA) • Mold package that does not require an insulating board or insulation bushing 2.54 TYP. 0.7 ±0.1 13.5 MIN. 12.0 ±0.2 insulatio. |
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|---|---|---|---|---|
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| 5 | 2SD2163 |
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| 7 | 2SD2164 |
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| 8 | 2SD2166 |
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| 9 | 2SD2166 |
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|
| 10 | 2SD2167 |
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|
Desde 2024. D4U Semiconductor.
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