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2SD2165 |
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| Part Number | 2SD2165 |
| Manufacturer | NEC |
| Description | of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these cir... |
| Features |
a small resin-molded
PACKAGE DRAWING (UNIT: mm)
10.0 ±0.3 4.5 ±0.2
φ 3.2 ±0.2
2.7 ±0.2
15.0 ±0.3
3 ±0.1 4 ±0.2
mounting cost reduction.
FEATURES
• High hFE and low VCE(sat): hFE ≅ 1,300 TYP. (VCE = 5.0 V, IC = 1.0 A) VCE(SAT) ≅ 0.3 V TYP. (IC = 3.0 A, IB = 30 mA) • Mold package that does not require an insulating board or insulation bushing 2.54 TYP. 0.7 ±0.1 13.5 MIN. 12.0 ±0.2 insulation package, thus contributing to high-density mounting and 1.3 ±0.2 1.5 ±0.2 2.54 TYP. 2.5 ±0.1 0.65 ±0.1 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Collector to base voltage Collector to emitte... |
| Document |
 2SD2165 Data Sheet
PDF 150.36KB |
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