BAS40 |
Part Number | BAS40 |
Manufacturer | Taiwan Semiconductor |
Description | Multiple manufacture source Multiple manufacture source Green compound Define manufacture source Green compound Document Number: DS_S1412006 Version: F14 Small Signal Product PACKAGE OUTLINE DIMENS... |
Features |
- Metal-on-silicon schottky barrier - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code with suffix "G" means
green compound (halogen-free)
MECHANICAL DATA
- Case: SOT- 23, molded plastic - Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260oC/10s - Weight: 0.008g (approximately)
SOT-23
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
VALUE
Power Dissipation
PD 200
Repetitive Peak... |
Document |
BAS40 Data Sheet
PDF 235.11KB |
No. | Parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
1 | BAS4 |
Motorola Inc |
CASE 318-08/ STYLE 8 SOT-23 TO-236AB | |
2 | BAS4 |
General Semiconductor |
Schottky Diodes | |
3 | BAS4 |
NXP |
Low-leakage diode | |
4 | BAS4 |
Microsemi Corporation |
SCHOTTKY array SERIES | |
5 | BAS4 |
Infineon Technologies AG |
Silicon Schottky Diode | |
6 | BAS40 |
Multicomp |
Surface Mount Barrier Diode |