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IRF8306MPBF |
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| Part Number | IRF8306MPBF |
| Manufacturer | International Rectifier |
| Description | The IRF8306MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a S... |
| Features |
has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF8306MPbF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance... |
| Document |
 IRF8306MPBF Data Sheet
PDF 280.06KB |
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Desde 2024. D4U Semiconductor.
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