| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Yamaichi |
144-Pin DIMM 6.80 4.60 REF. 67.60 ±0.15 3.70 1.35 0 1.10 -0.1 2.10 2.85 0.80 IC-497-*-1-** IC-497-*-2-** IC-497-*-3-** IC-497-*-4-** 37 4.00 MIN. 1.00 ± 0.1 7.50 MAX. 3.20 5.00 |
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Yamaichi Electronics |
72-pin DIMM 27x18=22.86) 1.27 ±0.05 0.635 ±0.05 M AX 30 8.04 ±0.05 4.84 ±0.05 .00 ∞ 2-DIA.3.20 +0.1 0 Thru Hole 1.27 ±0.05 1.27x35=44.45 ±0.1 P.C.BOARD HOLE PATTERN Pattern Shown Looking Down Through Top of Socket. 72-DIA0.80 +0.1 0 Thru Hole (Posit |
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Yamaichi Electronics |
160-pin DIMM |
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Yamaichi Electronics |
I.C. Socket / Quad Flat Package ring. Please call for other pin-counts. 57 Arrays Inline Memory Modules Small Outline Packages Quad Flat Packages Speciality Test Products (Open Top) IC200 Series QFP ∅ ∅ ∅ ∅ ∅ ∅ ∅ PC BOARD LAYOUTS ∅ ∅ 58 |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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Yamaichi Electronics |
Zig-Zag Inline Package í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5 |
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Yamaichi Electronics |
Zig-Zag Inline Package í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5 |
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Desde 2024. D4U Semiconductor.
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