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Yamaichi Electronics IC3 DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
IC37NRB-2003-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
2
IC37NRB-2203-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
3
IC37NRB-4206-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
4
IC37

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
5
IC37NRB-1404-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
6
IC37NRB-1603-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
7
IC37NRB-1803-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
8
IC37NRB-2004-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
9
IC37NRB-2403-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
10
IC37NRB-2406-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
11
IC37NRB-2804-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
12
IC37NRB-2806-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
13
IC37NRB-3206-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
14
IC37NRB-3204-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
15
IC39

Yamaichi Electronics
Zig-Zag Inline Package
í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5
Datasheet
16
IC39-1602**-G4

Yamaichi Electronics
Zig-Zag Inline Package
í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5
Datasheet
17
IC37NRB-1403-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
18
IC37NRB-2204-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
19
IC37NRB-2404-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet
20
IC37NRB-2803-G4

Yamaichi Electronics
Dual Inline Package
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S
Datasheet



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