No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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|
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Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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|
|
Yamaichi Electronics |
Zig-Zag Inline Package í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5 |
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|
Yamaichi Electronics |
Zig-Zag Inline Package í Applicable for ''zig-zag'' mounted leads í Dual wipe contacts ensure high reliability Outline Socket Dimensions A B C D E Recommended PC Board Layout Top View from Socket F (contact position) B D E H 2- Æ2.5 0.8 G Pin Count Æ0.8 2- Æ2.5 |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
|
|
|
Yamaichi Electronics |
Dual Inline Package í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline S |
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