No. | parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
|
|
WILLAS |
Plastic-Encapsulate Transistors Guardring for overvoltage protection. Epitaxial Planar Die Construction high-speed switching. • Ultra Complementary NPN Type Available epitaxial planar(TK3904LLD03) chip, metal silicon junction. • Silicon Ultra-Small Surface Mount Package parts meet |
|
|
|
WILLAS |
Plastic-Encapsulate Transistors • High surge capability. for overvoltage protection. • Guardring Epitaxial Planar Die Construction Ultra high-speed switching. • Complementary PNP Type Available (TK3906LLD03) Silicon epitaxial planar • Ultra-Small Surface Mount Package chip, metal s |
|
|
|
WILLAS |
Plastic-Encapsulate Transistors High surge capability. • Guardring for overvoltage protection. Epitaxial Planar Die Construction • Ultra high-speed switching. Complementary NPN Type Available (TK3904NND03) • Silicon epitaxial planar chip, metal silicon junction. Ultra-Small Surfac |
|
|
|
WILLAS |
Plastic-Encapsulate Transistors Package outline WBFBP-03B (1.2×1.2×0.5) unit: mm C Method 2026 RoHS product for packing code suffix ”G” • Polarity : Indicated by cathode band Halogen free product for packing code suffix “H” • Mounting Position : Any • Weight : Approximated 0.01 |
|