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WILLAS |
Plastic-Encapsulate Transistors • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to TRANSISToOptRim(izNePbNoa)rd space. FEATURE • • HLoigwhpcouwrreern |
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Desde 2024. D4U Semiconductor.
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