Vishay Siliconix UG2 Hoja de datos

No.	parte #	Fabricante	Descripción
1	UG2D	Vishay Siliconix	Miniature Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Soft recovery characteristics • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Ma
2	UG2F	Vishay Siliconix	(UG2F / UG2G) Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to W
3	UG2A	Vishay Siliconix	Miniature Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Soft recovery characteristics • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Ma
4	UG2B	Vishay Siliconix	Miniature Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Soft recovery characteristics • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Ma
5	UG2C	Vishay Siliconix	Miniature Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Soft recovery characteristics • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Ma
6	UG2G	Vishay Siliconix	(UG2F / UG2G) Ultrafast Plastic Rectifier • Glass passivated chip junction • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to W