Vishay SB3 Hoja de datos

No.	parte #	Fabricante	Descripción
1	SB3H90	Vishay Siliconix	High Voltage Schottky Rectifier • Guardring for overvoltage protection • Low power losses and high efficiency • Low forward voltage drop • Low leakage current • High forward surge capabilitmy • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cate
2	SB320	Vishay	Schottky Barrier Plastic Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High forward surge capability • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categori
3	SB350	Vishay	Schottky Barrier Plastic Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High forward surge capability • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categori
4	SB3H100	Vishay Siliconix	High Voltage Schottky Rectifier • Guardring for overvoltage protection • Low power losses and high efficiency • Low forward voltage drop • Low leakage current • High forward surge capabilitmy • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material cate
5	SB330A	Vishay Siliconix	Schottky Barrier Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability DO-201AD • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to Ro
6	SB340A	Vishay Siliconix	Schottky Barrier Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability DO-201AD • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to Ro
7	SB350A	Vishay Siliconix	Schottky Barrier Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability DO-201AD • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to Ro
8	VSB3200	Vishay	High-Voltage Trench MOS Barrier Schottky Rectifier • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TMBS® DO-201AD
9	VSB3200S	Vishay	High-Voltage Trench MOS Barrier Schottky Rectifier • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation DO-204AC (DO-15) • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
10	SB360	Vishay	Schottky Barrier Plastic Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High forward surge capability • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categori
11	SB360A	Vishay Siliconix	Schottky Barrier Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability DO-201AD • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to Ro
12	SB320S	Vishay Siliconix	Schottky Barrier Rectifier • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE
13	SB330S	Vishay Siliconix	Schottky Barrier Rectifier • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE
14	SB340S	Vishay Siliconix	Schottky Barrier Rectifier • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE
15	SB350S	Vishay Siliconix	Schottky Barrier Rectifier • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE
16	SB360S	Vishay Siliconix	Schottky Barrier Rectifier • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • 20 kV ESD capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE
17	VSSB310	Vishay	Surface Mount Trench MOS Barrier Schottky Rectifier • Low profile package TMBS ® • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Compliant to RoHS directiv
18	VSSB3L6S	Vishay	Surface Mount Trench MOS Barrier Schottky Rectifier TMBS ® • Low profile package • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Not recommended for PCB bott
19	SB30H150CT-1	Vishay	Dual Common Cathode High Voltage Schottky Rectifier • Power pack • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance ple
20	SB330	Vishay	Schottky Barrier Plastic Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High forward surge capability • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categori