No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Vishay |
Surface Mount Glass Passivated Rectifier • Low profile package • Ideal for automated placement • Glass passivated pallet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material ca |
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Vishay |
Surface Mount Glass Passivated Rectifier • Low profile package • Ideal for automated placement • Glass passivated pallet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material ca |
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Vishay |
Power Module / Single Switch - Power MOSFET • ID = 287 A, TC = 25 °C • ThunderFET power MOSFET • Reduced switching and conduction losses • Maximum 175 °C junction temperature • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • DC/DC conve |
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Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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Vishay |
Surface Mount Glass Passivated Rectifier • Low profile package • Ideal for automated placement • Glass passivated pallet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material ca |
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Vishay |
Surface Mount Glass Passivated Rectifier • Low profile package • Ideal for automated placement • Glass passivated pallet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material ca |
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Vishay Siliconix |
High Current Density Surface Mount Schottky Rectifier • Low profile package • Ideal for automated placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q1 |
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Vishay Siliconix |
High Current Density Surface Mount Schottky Rectifier • Low profile package • Ideal for automated placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q1 |
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Vishay |
Surface Mount Trench MOS Barrier Schottky Rectifier TMBS® • Low profile package • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AC (SMA) • Compliant to |
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Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
|
Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
|
Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
Vishay |
Transient Voltage Suppressors • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very fast response time • Low in |
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|
Vishay |
Surface Mount Glass Passivated Rectifier • Low profile package • Ideal for automated placement • Glass passivated pallet chip junction • Low forward voltage drop • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material ca |
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