| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Superior thermal conductivity Available • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance ple |
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Vishay Siliconix |
(BU2006 - BU2010) Enhanced PowerBridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay Siliconix |
(BU2006 - BU2010) Enhanced PowerBridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay Siliconix |
(BU2006 - BU2010) Enhanced PowerBridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU20065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Superior thermal conductivity Available • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance ple |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Superior thermal conductivity Available • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance ple |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
(BU2506-E3 - BU2510-E3) Bridge Rectifiers • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD |
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Vishay |
Single In-Line Bridge Rectifier • UL recognition file number E312394 • Glass passivated pellet chip junction • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Ideal for printed circuit boards • High surge current capability • High case dielectric strength of 2000 VRMS, 1 minute • M |
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Desde 2024. D4U Semiconductor.
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