UPM FR3 Hoja de datos

No.	parte #	Fabricante	Descripción
1	FR3M	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
2	FR3J	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
3	FR3K	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
4	FR3G	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
5	FR3D	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
6	FR3A	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture
7	FR3B	UPM	3A Surface Mount Fast Recovery Rectifier DO-214AB(SMC) * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture