| No. | parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
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UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
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UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
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UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
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|
UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
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|
|
UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
|
|
|
|
UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
|
|
|
|
UPM |
2A Fast Recovery Surface Mount Rectifier * Low profile package * Plastic package has under writers laboratory 94V-0 * Ideal for surface mounted application * Glass passivated chip juncyion * Bulit-in strain relief design * Fast switching for high efficient * High temperture soldering : 250o |
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Desde 2024. D4U Semiconductor.
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