logo

Techsem MDS DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
MDS100

Techsem
3-Phases Rectification Bridge Modules
n n n n n n Isolated mounting base 2500V~ Pressure contact technology with Increased power cycling capability Space and weight savings Inverter Inductive heating Chopper IO VRRM IFSM I2t 100 A 600~1600 V 1.2 A×103 7.2 A2 S*103 Typical Application
Datasheet
2
MDS30

TECHSEM
Three Phases Rectification Bridge Modules
n Isolated mounting base 2500V~ n Pressure contact technology with Increased power cycling capability n Space and weight savings Typical Applications n Inverter n Inductive heating n Chopper SYMBOL CHARACTERISTIC IO DC output current VRRM Repet
Datasheet
3
MDS75

TECHSEM
Three Phases Rectification Bridge Modules
n Isolated mounting base 2500V~ n Solder joint technology with Increased power cycling capability n Space and weight saving Typical Applications n Inverter n Inductive heating n Chopper VRSM 900V 1100V 1300V 1500V 1700V 1900V VRRM 800V 1000V 1200V
Datasheet
4
MDS200

TECHSEM
Three Phases Rectification Bridge Modules

 Isolated mounting base 2500V~
 Solder joint technology with Increased power cycling capability
 Space and weight saving Typical Applications
 Inverter
 Inductive heating
 Chopper VRSM 900V 1100V 1300V 1500V 1700V 1900V VRRM 800V 1000V 1200V
Datasheet
5
MDS150

TECHSEM
Three Phases Rectification Bridge Modules

 Isolated mounting base 2500V~
 Solder joint technology with Increased power cycling capability
 Space and weight saving Typical Applications
 Inverter
 Inductive heating
 Chopper VRSM 900V 1100V 1300V 1500V 1700V 1900V VRRM 800V 1000V 1200V
Datasheet



logo    Desde 2024. D4U Semiconductor.   |   Contáctenos   |   Política de Privacidad