No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
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Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
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Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
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Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
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Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
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Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
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Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
|
|
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Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
|
|
|
Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
|
|
|
Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
|
|
|
Taiwan Semiconductor |
3.0 AMPS. Soft Fast Recovery Rectifiers Low forward voltage drop High current capability High reliability High surge current capability Fast switching for high efficiency Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, Lead free., solderabl |
|
|
|
Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
|
|
|
Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
|
|
|
Taiwan Semiconductor |
Fast Recovery Rectifiers High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic Epoxy: UL 94V-0 rate flame ret |
|
|
|
Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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Taiwan Semiconductor |
3.0AMPS Glass Passivated Fast Recovery Rectifiers Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Cases: Molded plastic |
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