| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Microsemi |
SURFACE MOUNT 3000 Watt Transient Voltage Suppressor |
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AVAGO |
Schottky Assisted Low Power PIN Diode Limiter • Low Power Limiter with unique combination of PIN and Schottky Diode • Low limiting threshold power (OP1dB: 6.05 dBm @900MHz) • Semi integrated solution in Surface Mount SOT-323 Package – increase flexibility – save board space – reduce cost • |
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TT |
Silicon Carbide Schottky Barrier Diode tly controlled where TJ(Max) does not exceed 225°C; This equates to RθJA (PCB) ≤ 115°C/W. (2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air. (3) PCB = FR4, 0.0625 |
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TT |
Silicon Carbide Schottky Barrier Diode tly controlled where TJ(Max) does not exceed 225°C; This equates to RθJA (PCB) ≤ 115°C/W. (2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air. (3) PCB = FR4, 0.0625 |
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TT |
SiC SCHOTTKY DIODE tion To Ambient, On PCB RθJA(PCB) Thermal Resistance, Junction To Ambient, On PCB Max. 52.5 TBC TBC Units °C/W °C/W °C/W Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Informatio |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Microsemi |
SURFACE MOUNT 3000 Watt Transient Voltage Suppressor |
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Microsemi |
Surface Mount 3000 Watt Transient Voltage Suppressor The following are key features of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A through MSMLJ170CAe3 devices: High-reliability devices with fabrication and assembly lot traceability for all M prefix devices All devices are 100% surge tested 3σ |
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Microsemi |
SURFACE MOUNT 3000 Watt Transient Voltage Suppressor |
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Seme LAB |
SILICON CARBIDE POWER SCHOTTKY RECTIFIER DIODE BRIDGE x. 2.2 2.7 100 1000 Units V Reverse Current µA DYNAMIC CHARACTERISTICS QC Total Capacitative Charge IF = 10A di/dt = 500A/µs VR = 600V TJ = 25°C 32 nC Notes (1) Pulse Width ≤ 300us, δ ≤ 2% Semelab Limited reserves the right to change test condi |
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TT |
SiC SCHOTTKY DIODE tion To Ambient, On PCB RθJA(PCB) Thermal Resistance, Junction To Ambient, On PCB Max. 52.5 TBC TBC Units °C/W °C/W °C/W Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Informatio |
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TT |
Silicon Carbide Schottky Barrier Diode tly controlled where TJ(Max) does not exceed 225°C; This equates to RθJA (PCB) ≤ 115°C/W. (2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air. (3) PCB = FR4, 0.0625 |
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TT |
SILICON CARBIDE SCHOTTKY BARRIER DIODE point to ambient is sufficiently controlled where TJ(Max) does not exceed 225°C; This equates to RθJA(PCB) ≤ 115°C/W. (2) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in stil |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Bourns |
Low Ohmic PTC Resettable Fuses n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognitio |
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Microsemi |
SURFACE MOUNT 3000 Watt Transient Voltage Suppressor |
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Microsemi |
Surface Mount 3000 Watt Transient Voltage Suppressor The following are key features of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A through MSMLJ170CAe3 devices: High-reliability devices with fabrication and assembly lot traceability for all M prefix devices All devices are 100% surge tested 3σ |
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Desde 2024. D4U Semiconductor.
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