TRSYS 3EZ Hoja de datos

No.	parte #	Fabricante	Descripción
1	3EZ68	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
2	3EZ13	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
3	3EZ47	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
4	3EZ51	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
5	3EZ110	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
6	3EZ12	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
7	3EZ130	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
8	3EZ140	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
9	3EZ15	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
10	3EZ16	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
11	3EZ170	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
12	3EZ18	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
13	3EZ190	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
14	3EZ200	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
15	3EZ22	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
16	3EZ24	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
17	3EZ43	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
18	3EZ56	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
19	3EZ62	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has
20	3EZ75	TRSYS	GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has