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TOREX |
Packaging Information / Reference Pattern Layout Dimensions Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% connected to the package heat-sink. Material: Glass Epoxy (FR-4) Thickness: 1.0 mm Through-hole: 4 x 0.4 Diameter 40.0 2.5 28 |
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Desde 2024. D4U Semiconductor.
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