TIPTEK 1SM Hoja de datos

No.	parte #	Fabricante	Descripción
1	1SMA4739	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
2	1SMA4758	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
3	1SMA4752	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
4	1SMA4747	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
5	1SMA4729	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
6	1SMA4761	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
7	1SMA4760	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
8	1SMA4759	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
9	1SMA4757	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
10	1SMA4756	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
11	1SMA4754	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
12	1SMA4753	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
13	1SMA4743	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
14	1SMA4740	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
15	1SMA4738	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
16	1SMA4735	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
17	1SMA4734	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
18	1SMA4731	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
19	1SMA4730	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI
20	1SMA4728	TIPTEK	1W SURFACE MOUNT SILICON ZENER DIODE  LOW PROFILE PACKAGE  BUILT-IN STRAIN RELIEF  LOW INDUCTANCE  HIGH TEMPERATURE SOLDERING:260°C/10 SECONDS AT TERMINALS  PLASTIC PACKAGE HAS UNDERWRITERS FLAMMABILITY CLASSIFICATION 94V-O LABORATORY MECHANICAL DATA  CASE：MOLDED PLASTIC  TERMI