TDK C75 Hoja de datos

No.	parte #	Fabricante	Descripción
1	C7563X7S1C107M280LE	TDK	MULTILAYER CERAMIC CHIP CAPACITORS • Higher mechanical endurance is realized by flexible resin layers. • X8R type which maximum temperature is up to 150°C is applicable. • C0G temperature characteristic which has excellent stable tempera- ture and DC-bias characteristcs is applicable.
2	C7563X7R1E476M230LE	TDK	MULTILAYER CERAMIC CHIP CAPACITORS • Higher mechanical endurance is realized by flexible resin layers. • X8R type which maximum temperature is up to 150°C is applicable. • C0G temperature characteristic which has excellent stable tempera- ture and DC-bias characteristcs is applicable.
3	C7563	TDK	MULTILAYER CERAMIC CHIP CAPACITORS • Higher mechanical endurance is realized by flexible resin layers. • X8R type which maximum temperature is up to 150°C is applicable. • C0G temperature characteristic which has excellent stable tempera- ture and DC-bias characteristcs is applicable.
4	C0402C0G1C750G	TDK	Multilayer Ceramic Chip Capacitors • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting
5	C0402C0G1C750J	TDK	Multilayer Ceramic Chip Capacitors • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting
6	C7563X7S1H226M230LE	TDK	MULTILAYER CERAMIC CHIP CAPACITORS • Higher mechanical endurance is realized by flexible resin layers. • X8R type which maximum temperature is up to 150°C is applicable. • C0G temperature characteristic which has excellent stable tempera- ture and DC-bias characteristcs is applicable.