TAYCHIPST GS1 Hoja de datos

No.	parte #	Fabricante	Descripción
1	GS1000FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
2	GS1001FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
3	GS1008FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
4	GS1010FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
5	GS1002FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
6	GS1004FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di
7	GS1006FL	TAYCHIPST	SMALL SURFACE MOUNT SUPER FAST DIODES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated Chip Junction • High temperature soldering : 260OC / 10 seconds at terminals • Pb free product : 99% Sn can meet RoHS environment substance di