No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Semico |
FM Front End Ôçµ ¹¦ ÄÜ OUTMIX OUTAFC OSC VCC 3. ÔÐØÌçµ 3. 1 ý Ê Î ² Þ Ï « ¼ ¨¶æ¹ÐÓíÁÇ ·ý³ ²Î ¹Ñçµ´Ôçµ ¹ÑçµÅ½ýÒ Äº¦¹ ȶÂγ¾ ·»÷פ¹ ȶÂÎæ´üÖ ×¢ §Î¶ ·¹Ñçµ´Ôçµ÷פ¹ Êý Ãû ³Æ Tamb= 25 ·û ºÅ VCC V3 V6 PD Tamb Tstg 1.8 7.5V ¹ Ñ ç µ ´ Ô ç µ ö ¼ Æ Í 4.5V Ta<80 Ìõ ¼þ ¶î ¶¨ |
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Fairchild Semiconductor |
MOSFET • RDS(on) = 1.05 Typ.) • Ultra Low Gate Charge (Typ. Qg = 16.2 nC) • Low Eoss (Typ. 1.57 uJ @ 400V) • Low Effective Output Capacitance (Typ. Coss(eff.) = 48.7 pF) • 100% Avalanche Tested • RoHS Compliant • ESD Improved Capability Applications • AC |
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Zetex Semiconductors |
HIGH FIDELITY CLASS D AUDIO AMPLIFIER SOLUTION • • • • • • >90% efficiency 4 / 8 Ω drive capability Noise Floor -115dB for solution Flat response 20Hz - 20kHz High gate drive capability ( 2200pF) Very low THD + N 0.2% typical full 90% power, full band ( for the solution) Distortion v Power 8Ω op |
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Zetex Semiconductors |
HIGH FIDELITY CLASS D AUDIO AMPLIFIER SOLUTION • 90% efficiency • External ROSC COSC for improved accuracy • 4 / 8 Ω drive capability • Noise Floor -115dB for solution • Flat response 20Hz - 20kHz • High gate drive capability ( 2200pF) • Very low THD + N 0.2% typical of full power up to 90% ( for |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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Toshiba Semiconductor |
CCD LINEAR IMAGE SENSOR CCD l Number of Image Sensing Elements : 128 elements l Image Sensing Element Size : 32µm×32µm on 32µm centers l Photo Sensing Region l Clock l Internal Circuit l Package : High sensitive pn photodiode : 3 Input pulses 5V : Sample & Hold circuit, Clamp c |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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NXP Semiconductors |
Secure dual interface and contact PKI smart card controller a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core |
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AiT Semiconductor |
CHIP INDUCTOR 1. Fit for Power Line & Signal Line Circuit 2. Pass the CE/FCC purpose 3. Operating Temperature: +40 ~ +85℃ ●APPLICATION Mobil Device, Handheld Device, LowProfile Device, Panel. ●ORDERING INFORMATION WCD Series 160808 Dimension (L*W*H) H Materia |
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AiT Semiconductor |
CHIP INDUCTOR 1. Fit for Power Line & Signal Line Circuit 2. Pass the CE/FCC purpose 3. Operating Temperature: +40 ~ +85℃ ●APPLICATION Mobil Device, Handheld Device, LowProfile Device, Panel. ●ORDERING INFORMATION WCD Series 160808 Dimension (L*W*H) H Materia |
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