| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
Miniature SMD Glass Passivated Bridge Rectifiers Halogen-free type Internal structure with GPRC (Glass Passivated Rectifier Chip) inside Lead free product, compliance to RoHS Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, high effic |
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SeCoS |
Surface Mount Bridge Rectifiers High Surge Current Capability Designed for Surface Mount Application MECHANICAL DATA Case: MBF Terminals: Solderable per MIL-STD-750, Method 2026 MARKING Part Number MB240F-C MB260F-C Marking MB24F MB26F Part Number MB2100F-C MB2200F-C Marking M |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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SeCoS |
2.0 Watts Surface Mount Zener Diode Glass passivated chip Low leakage Built-in strain relief Low inductance High peak reverse power dissipation Lead (Pb)-free component For use in stabilizing and clipping circuits with high power rating MECHANICAL DATA Case：SMB Epoxy |
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Desde 2024. D4U Semiconductor.
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