| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Sanyo Semicon Device |
High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications · Composite type with 2 transistors contained in the MCP package currently in use, improving the mounting efficiency greatly. · The FH104 is formed with two chips equivalent to the 2SC4853 placed in one package. · Excellent in thermal equilibrium and |
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Sanyo Semicon Device |
High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications · Composite type with 2 transistors contained in the MCP package currently in use, improving the mounting efficiency greatly. · The FH103 is formed with two chips, being equivalent to the 2SC4867, placed in one package. · Excellent in thermal equilib |
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Sanyo Semicon Device |
High-Frequency Low-Noise Amplifier/ Differential Amplifier Applications · Composite type with 2 transistors contained in the MCP package currently in use, improving the mounting efficiency greatly. · The FH105 is formed with two chips, being equivalent to the 2SC5245, placed in one package. · Excellent in thermal equilib |
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Sanyo Semicon Device |
1.0A Power Rectifier |
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Sanyo Semicon Device |
High-Frequency Low-Noise Amp/ Differential Amp Applications Package Dimensions • Composite type with 2 transistors contained in the MCP unit: mm package currently in use, improving the mounting 2149-MCP6 efficiency greatly. • The FH102 is formed with two chips, being equivalent to the 2SC5226, placed in one |
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Desde 2024. D4U Semiconductor.
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