No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Sanyo Semicon Device |
PIN Diode · Very small-sized package facilitates high-density mounting and permits 1SV233-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=5Ω typ). Package Dimensions unit:mm 1148A [ |
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Sanyo Semicon Device |
PIN Diode · Series connection of 2 elements in an ultrasmall package facilitates high-density mounting and permits 1SV234-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=5Ω typ). Pa |
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Sanyo Semicon Device |
PIN Diode · Series connection of 2 elements in a very small-sized package facilitates high-density mounting and permits 1SV246-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=5Ω typ) |
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Sanyo Semicon Device |
PIN Diode · Small-sized package facilitates high-density mounting and permits 1SV250-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=4.5Ω max). Package Dimensions unit:mm 1148A [1SV |
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Sanyo Semicon Device |
PIN Diode · Series connection of 2 elements in a Very smallsized package facilitates high-density mounting and permits 1SV272-applied equipment to be made smaller. · Small interterminal capacitance (C=0.6pF typ). · Small forward series resistance (rs=0.5Ω typ) |
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Sanyo Semicon Device |
Silicon Epitaxial Pin Diode · Ultrasmall-sized package facilitates high-density mounting and permits 1SV315-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). Electrical Connection Cathode / Anode 3 Package Dimensions unit:mm 1246A [1SV315] |
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Sanyo Semicon Device |
PIN Diode · Composite type with 2 diodes contained in the CP package currently in use, improving the mounting efficiency greatly. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=5Ω typ). Package Dimensions unit:mm 1236A |
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Sanyo Semicon Device |
PIN Diode · Very small-sized package facilitates high-density mounting and permits 1SV247-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=5Ω typ). Package Dimensions unit:mm 1197A [ |
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Sanyo Semicon Device |
PIN Diode · Very small-sized package facilitates high-density mounting and permits 1SV248-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=4.5Ω max). Package Dimensions unit:mm 1197A |
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Sanyo Semicon Device |
PIN Diode · Very small-sized package facilitates high-density mounting and permits 1SV249-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=4.5Ω max). Package Dimensions unit:mm 1246A |
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Sanyo Semicon Device |
PIN Diode · Small-sized package facilitates high-density mounting and permits 1SV251-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=4.5Ω max). Package Dimensions unit:mm 1251A [1SV |
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Sanyo Semicon Device |
PIN Diode · Very small-sized package facilitates high-density mounting and permits 1SV236-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ). Package Dimensions unit:mm 1197A |
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Sanyo Semicon Device |
PIN Diode · Series connection of 2 elements in an ultrasmall package facilitates high-density mounting and permits 1SV264-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ). |
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Sanyo Semicon Device |
PIN Diode · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ). · Composite type with 2 diodes contained in the CP package currently in use, improving the mounting efficiency greatly. Package Dimensions unit:mm 123 |
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Sanyo Semicon Device |
PIN Diode · Small sized package facilitates high-denstiy mounting and permits 1SV266-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ). Package Dimensions unit:mm 1148A [1SV |
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Sanyo Semicon Device |
PIN Diode · Series connection of 2 elements in a very smallsized package facilitates high-density mounting and permits 1SV267-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ |
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Sanyo Semicon Device |
PIN Diode · Small interterminal capacitance (C=0.7pF typ). · Small forward series resistance (rs=0.5Ω typ). Package Dimensions unit:mm 1163A [1SV268] 1:Anode 2:Cathode 3:No Contact SANYO:PCP Specifications Absolute Maximum Ratings at Ta = 25˚C Parameter Rev |
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Sanyo Semicon Device |
Silicon Epitaxial PIN Diode · Small-sized package facilitates high-density mounting and permits 1SV294-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=2.5Ω typ). Package Dimensions unit:mm 1148A [1SV |
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Sanyo Semicon Device |
Silicon Epitaxial PIN Diode · Composite type with 3 diodes contained in the CP package currently in use, improving the mounting efficiency greatly. · Small interterminal capacitance (C=0.23pF typ). · Small forward series resistance (rs=7.5Ω typ). Package Dimensions unit:mm 126 |
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Sanyo Semicon Device |
Silicon Epitaxial Pin Diode · Ultrasmall-sized package facilitates high-density mounting and permits 1SV316-applied equipment to be made smaller. · Small interterminal capacitance (C=0.23pF typ). Electrical Connection Cathode / Anode 3 Package Dimensions unit:mm 1251A [1SV316] |
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