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SEMTECH US1 DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
US1AF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
2
US1BF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
3
US1DF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
4
US1GF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
5
US1KF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
6
US1MF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet
7
US1JF

SEMTECH
Surface Mount Ultrafast Recovery Rectifier

• Glass Passivated Chip Juntion
• For surface mount applications
• Low profile package
• Easy to pick and place
• High efficiency SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, method 2
Datasheet



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