| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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|
SEMTECH |
Surface Mount Superfast Recovery Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time SMBF 5.5 5.1 4.4 4.2 3.7 3.5 2.2 1.9 Mechanical Data • Case: SMBF • Terminals: Solderable per 1.3 1.1 MIL-STD-750, Method |
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SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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|
SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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|
SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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|
SEMTECH |
Glass Passivated Super Fast Rectifier • Glass Passivated Chip Juntion • For surface mounted applications • Low profile package • Superfast reverse recovery time Mechanical Data • Case: SMAF • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.8 |
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Desde 2024. D4U Semiconductor.
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