No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Semikron International |
Bridge Rectifier 3 3&= 3 % 6 6 Typical Applications* 0 1 1) ! |
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Semikron |
SK3Gxx |
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Semikron |
NPN Power-Darlington |
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Semikron |
NPN Power-Darlington |
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Semikron |
IGBT • One screw mounting module • Solder free mounting with Press-Fit terminals • Fully compatible with other SEMITOP® Press-Fit types • Improved thermal performances by aluminum oxide substrate • 650V Trench3 Fast IGBT technology • 650V Rapid switching |
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Semikron |
NPN Power-Darlington |
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Semikron |
NPN Power-Darlington |
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Semikron |
NPN Power-Darlington |
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Semikron International |
IGBT ± ± ± ± ± ± 8QLWV 9 QV QV QV QV PQ) .: %*% )HDWXUHV &RPSD.W GHVLJQ 2QH V.UHZ PRXQWLQJ +HDW WUDQVIHU DQG LVRODWLRQ WKURXJK GLUH.W .RSSHU ERQGHG DOXPLQLXP R[LGH .HUDPL. '&% 1 .KDQQHO KRPRJHQHRXV VLOL.RQ VWUX.WXUH 137 1RQ3XQ.K WKURXJ |
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Semikron International |
IGBT 7F. GGG H0>1 7F. GGG H081 $/ 0 G 81.. 9 9 + + !" # $% # &' ! ( |
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Semikron International |
IGBT Typical Applications " &2 " *#" ! |
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Semikron International |
3-phase bridge inverter !"# $ %&# '( $ )* % !# Typical Applications* %+ Abs |
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Semikron International |
IGBT ! " # ! Characteristics Symbol Conditions IGBT - Inverter $%! $%13 $%13 419:3 1 3 1 ,,3 , % % ,, ' > |
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Semikron International |
IGBT ! " #$! %& " '( # )! Typical Applications* #* DGDL - ET |
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Semikron International |
MOSFET Module Characteristics Symbol Conditions MOSFET 0A## 03# 5## 53## A# A# $# A:! 0# 5AA( K 0> 5AA( K (1 |
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Semikron International |
Antiparallel Thyristor Module Typical Applications 1 ) + ,,, 2 ! " # |
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Semikron International |
Antiparallel Thyristor Module Typical Applications 1 ) + ,,, 2 ! " # |
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SEMIKRON |
IGBT • Compact design • One screw mounting module • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) • 600V Trench IGBT3 technology • 600V CAL IHD diode technology • Integrated NTC temperature sensor • UL recognized |
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Semikron |
IGBT • Compact design • One screw mounting module • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • 650V Fast Trench3 IGBT technology • CAL diode technology • Integrated NTC temperature sensor • UL recognized, file |
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Semikron |
IGBT • One screw mounting module • Solder free mounting with Press-Fit terminals • Fully compatible with other SEMITOP® Press-Fit types • Improved thermal performances by aluminum oxide substrate • 650V Trench3 Fast IGBT technology • 650V Rapid switching |
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