No. | parte # | Fabricante | Descripción | Hoja de Datos |
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ROHM |
Schottky Barrier Diode 1) Ultra small mold type (UMD3F) 2) High reliability 3) Super low VF lConstruction Silicon epitaxial planar type lDimensions (Unit : mm) 2.0±0.1 0.32 +0.1 -0.05 Each leads has same dimensions 0.9±0.1 lLand Size Figure (Unit : mm) 1.3 0.53±0.1 |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Low capacitance ●Inner Circuit Data sheet ●Application ●Packaging Specifications High speed switching Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Orderi |
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Rohm |
Schottky barrier diode High reliability Small mold type Low capacitance ●Inner Circuit Data sheet ●Application ●Packaging Specifications High speed switching Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) 8 Quantity(p |
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Rohm |
Schottky barrier diode High reliability Small mold type Low capacitance ●Inner Circuit Data sheet ●Application ●Packaging Specifications High speed switching Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) 8 Quantity(p |
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Rohm |
Schottky barrier diode 1) Ultra small power mold type. (EMD3) 2) Low IR 3) High reliability. Construction Silicon epitaxial planar Dimensions (Unit : mm) 1.6± 0.2 0.3±0.1 0.05 (3) 0.15±0.05 Land size figure (Unit : mm) 1.0 0.5 0.5 0.7 0.8±0.1 1. 6±0. 2 0.1Min 0 |
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Rohm |
Schottky barrier diode 1) Small surface mounting type. (SMD6) 2) Low VF and low IR. 3) Three diodes in parallel for easy installation. 0.95 0.95 0.8±0.1 2.8±0.2 +0.2 −0.1 0∼0.1 RB731U Diodes !Electrical characteristic curves (Ta=25°C) Typ. pulse measurement FORWARD C |
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Rohm |
Schottky barrier diode 1) Small power mold type.(VMD2) 2) Low VF 3) High reliability Construction Silicon epitaxial planar 0.27±0.03 0.5±0.05 VMD2 Structure ROHM : VMD2 dot (year week factory) Taping specifications (Unit : mm) 4±0.1 2±0.05 φ1.5+0.1 0 0.18± |
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Rohm |
Schottky Barrier Diode 1)Ultra small mold type. (EMD2) 2)High reliability 0.6 EMD2 lConstruction Silicon epitaxial 0.3±0.05 0.6±0.1 lStructure ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory) lTaping specifications (Unit : mm) lAbsolute maximum rat |
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ROHM |
Schottky barrier diode 1) Ultra small mold type. (UMD2) 2) Low VF 3) High reliability zExternal dimensions (Unit : mm) 1.25±0.1 0.1±0.1 0.05 zConstruction Silicon epitaxial planar 0.3±0.05 ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot (year week factory) 0.7±0.2 |
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ROHM |
Schottky Barrier Diode 1) Small mold type (EMD3F) 2) High reliability 3) Super low VF lConstruction Silicon epitaxial planar type lDimensions (Unit : mm) 1.60±0.1 0.70±0.10 0.26 +0.10 -0.05 Each lead has same dimensions (3) lLand Size Figure (Unit : mm) 0.5 0.5 0.7 |
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ROHM |
Schottky Barrier Diode 1) Ultra small mold type (EMD3F) 2) High reliability 3) Super low VF lConstruction Silicon epitaxial planar type lDimensions (Unit : mm) 1.60±0.1 0.70±0.10 0.26 +0.10 -0.05 Each lead has same dimensions (3) lLand Size Figure (Unit : mm) 0.5 0. |
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Rohm |
Schottky barrier diode High reliability Small mold type Low capacitance ●Inner Circuit Data sheet ●Application ●Packaging Specifications High speed switching Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Orderi |
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Rohm |
Schottky barrier diode 1) Small surface mounting type. (SMD3) 2) Low reverse current and low forward voltage. 3) Multiple diodes with common cathode configuration. 2.8±0.2 +0.2 −0.1 0~0.1 +0.1 −0.05 +0.1 −0.06 RB705D Diodes zElectrical characteristic curves (Ta = 25° |
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Rohm |
Schottky barrier diode 1) Small mold type. (UMD3) 2) Low VF 3) High reliability. lConstruction Silicon epitaxial planar lDimensions (Unit : mm) 2.0±0.2 0.3±0.1 Eaリchーleドadとhaもs same dimension (3) 0.15±0.05 lLand size figure (Unit : mm) 1.3 0.65 1.25±0.1 2.1±0.1 0.1Mi |
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Rohm |
Schottky barrier diode 1) Ultra small mold type. (EMD2) 2) Low VF 3) High reliability Construction Silicon epitaxial planar 0.3±0.05 ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory) Taping specifications(Unit : mm) 4.0±0.1 2.0±0.05 0.6±0.1 φ1.5±0.05 |
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Rohm |
Schottky barrier diode 1) Ultra small mold type. (UMD2) 2) Low VF 3) High reliability zExternal dimensions (Unit : mm) 1.25±0.1 0.1±0.1 0.05 zConstruction Silicon epitaxial planar 0.3±0.05 ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot (year week factory) 0.7±0. |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Low capacitance ●Inner Circuit ●Application ●Packaging Specifications High speed switching Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Ordering Unit(pcs |
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Rohm |
Schottky barrier diode 1) Ultra Small mold type(VMN2) 2) Low VF 3) High reliability 0 .6±0.05 0.16±0.05 Land size figure (Unit : mm) 0.9±0.05 1.0±0.05 Structure Silicon epitaxial planer 0.156 0.35±0.1 0.37±0.03 ROHM : VMN2 dot (year week factory)+day Structure |
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Rohm |
Schottky Barrier Diode 1)Ultra small mold type. (EMD3) 2)High reliability 0.2±0.1 -0.05 (2) (3) 0.7 1.6±0.2 0.7 0~0.1 0.6 0.6 0.1Min (1) 0.55±0.1 0.7±0.1 EMD3 0.5 0.5 1.0±0.1 Construction Silicon epitaxial planer Structure ROHM : JEDEC : SOT-416 JEITA : SC- |
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Rohm |
Schottky barrier diode 1) Small mold type. (UMD3) 2) Low VF 3) High reliability. r r /KP r r r zStructure zConstruction Silicon epitaxial planar z Taping specifications (Unit : mm) |
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