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Renesas |
Silicon Schottky Barrier Diode • Low reverse current, Low capacitance. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Type No. HSC226 Cathode Mark S4 Package Name UFP Package Code PWSF0002ZA-A Pin Arrangement Cathode mark Mark 1 |
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Desde 2024. D4U Semiconductor.
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