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Schottky Barrier Diode High reliability Small mold type Low VF ●Inner Circuit Data sheet ●Application ●Packaging Specifications General rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Ordering Unit( |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Super Low VF ●Inner Circuit Data sheet NotNeRewcDoemsimgennsded for ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Struct |
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ROHM |
Schottky Barrier Diode 1)Small power mold type.(TUMD2) 2)High reliability 3)AEC-Q101 qualified lConstruction Silicon epitaxial lExternal Dimensions(Unit : mm) 1.3±0.05 0.17±0.1 0.05 lLand Size Figure(Unit : mm) 1.1 1.9±0.1 2.5±0.2 0.8 0.5 2.0 TUMD2 lStructure 0.8 |
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Schottky Barrier Diode High reliability Small mold type Low VF ●Inner Circuit ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) 8 Basic Ordering Unit(p |
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ROHM |
Schottky Barrier Diode 1) Small mold type (EMD3F) 2) High reliability 3) Super low VF lConstruction Silicon epitaxial planar type lDimensions (Unit : mm) 1.60±0.1 0.70±0.10 0.26 +0.10 -0.05 Each lead has same dimensions (3) lLand Size Figure (Unit : mm) 0.5 0.5 0.7 |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Super Low VF ●Inner Circuit Data sheet ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Or |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Low VF ●Inner Circuit Data sheet ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Ordering |
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Schottky barrier diode 1) Ultra Small mold type. (UMD2) 2) Low IR 3) High reliability. zExternal dimensions (Unit : mm) 1.25±0.1 0.1±0.1 0.05 zConstruction Silicon epitaxial planar 0.3±0.05 ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot (year week factory) 0.7±0.2 |
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Schottky Barrier Diode 1) Small mold type. (UMD6) 2) High reliability. K K K (3) (2) (1) (3) (2) (1) 0∼0.1 (4) (5) (6) A A A 0.2 +0.1 −0.05 0.15±0.05 Conditions 1/2 RB531XN Diodes !Electrical characteristic curves (Ta=25°C) 1 10m 1m REVERSE CURRENT : IR (A) 10 |
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Schottky Barrier Diode 1) Small mold type (VMN2M) 2) High reliability 3) Low VF lConstruction Silicon epitaxial planar type 0~0.10 (2) 0.22±0.05 0.60±0.05 0.16±0.05 ROHM : VMN2M : Manufacture year/ week/ factory lTaping Dimensions (Unit : mm) f1.55±0.05 4.0±0.05 2.0± |
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Schottky barrier diode 1) Ultra small mold type. (EMD2) 2) Low VF 3) High reliability Construction Silicon epitaxial planar 1.2±0.05 1.6±0.1 0.3±0.05 ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory) 0.6±0.1 Taping dimensions (Unit : mm) 4.0±0.1 2.0± |
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Rohm |
Schottky Barrier Diode 1)Ultra small mold type. (EMD2) 2)Low IR 3)High reliability lConstruction Silicon epitaxial 0.3±0.05 ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory) 0.6±0.1 EMD2 lStructure lTaping specifications (Unit : mm) lAbsolute maximum ra |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Super Low VF ●Inner Circuit ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) Basic Ordering Unit |
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ROHM |
Schottky Barrier Diode lExternal Dimensions(Unit : mm) 1.3±0.05 0.17±0.1 0.05 for lLand Size Figure(Unit : mm) 1.1 1.9±0.1 2.5±0.2 0.8 0.5 2.0 1)Small power mold type.(TUMD2) 2)High reliability 3)AEC-Q101 qualified ed lConstruction end ns Silicon epitaxial TUMD2 |
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Schottky Barrier Diode 1) Ultra small mold type (EMD3F) 2) High reliability 3) Low VF lConstruction Silicon epitaxial planar type lDimensions (Unit : mm) 1.60±0.1 0.70±0.10 0.26 +0.10 -0.05 Each lead has same dimensions (3) lLand Size Figure (Unit : mm) 0.5 0.5 0.7 |
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Schottky Barrier Diode 1) Small silicon package (SMD0603) 2) High Accuracy Manufacturing Dimension tolerance10mm 3) Low VF lConstruction Silicon epitaxial planar type F 0～0.030 0.280±0.010 0.260±0.010 0.300±0.010 ROHM: SMD0603 lTaping Dimensions (Unit : mm) SMD0603 |
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Schottky barrier diode 1) Ultra small mold type. (VMD2) 2) High reliability 0.6±0.05 0.27±0.03 CATHODE MARK 0.13±0.03 F zConstruction Silicon epitaxial planer 0.5±0.05 ROHM : VMD2 EIAJ : JEDEC : zAbsolute maximum ratings (Ta=25°C) Parameter Reverse voltage (DC) Aver |
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Schottky barrier diode 1)Ultra small mold type.（EMD2） 2)Low VF 3)High reliability Construction Silicon epitaxial planar 0.3±0.05 ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory) Taping specifications(Unit : mm) 4.0±0.1 2.0±0.05 0.6±0.1 φ1.5±0.05 φ1.55 |
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Schottky barrier diode |
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Schottky barrier diode 1)Small mold type（TUMD2） 2)Low VF, Low IR 3)High reliability lConstruction Silicon epitaxial planar lDimensions (Unit : mm) 1.3±0.05 0.17±0.1 0.05 lLand size figure (Unit : mm) 1.1 1.9±0.1or 2.5±0.2 0.8 0.5 2.0 TUMD2 0.8±0.05 ROHM : TUMD2 |
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Desde 2024. D4U Semiconductor.
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