| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx12-L) MCM LNA LCL0912-L / LCL1512-L LCL1812-L Applications • 2G & 3G Repeater • Base Station • PCS, CDMA, W-CDMA • GSM, DCS, UMTS • WiMAX, Wibro, WLAN • RF Sub-Systems Package : CP-16B • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching |
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RFHIC |
(LCL1x03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCL1x03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx04-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx04-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCL3x12-L) MCM LNA LCL3212-L / LCL3512-L LCL3712-L Applications • 2G & 3G Repeater • Base Station • PCS, CDMA, W-CDMA • GSM, DCS, UMTS • WiMAX, Wibro, WLAN • RF Sub-Systems Package : CP-16B • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx12-L) MCM LNA LCL0912-L / LCL1512-L LCL1812-L Applications • 2G & 3G Repeater • Base Station • PCS, CDMA, W-CDMA • GSM, DCS, UMTS • WiMAX, Wibro, WLAN • RF Sub-Systems Package : CP-16B • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching |
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RFHIC |
(LCLxx12-L) MCM LNA LCL0912-L / LCL1512-L LCL1812-L Applications • 2G & 3G Repeater • Base Station • PCS, CDMA, W-CDMA • GSM, DCS, UMTS • WiMAX, Wibro, WLAN • RF Sub-Systems Package : CP-16B • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx04-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCL3x12-L) MCM LNA LCL3212-L / LCL3512-L LCL3712-L Applications • 2G & 3G Repeater • Base Station • PCS, CDMA, W-CDMA • GSM, DCS, UMTS • WiMAX, Wibro, WLAN • RF Sub-Systems Package : CP-16B • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching |
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Desde 2024. D4U Semiconductor.
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