No. | parte # | Fabricante | Descripción | Hoja de Datos |
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RFHIC |
(LCLxx02-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & MESFET chip on board • No matching circuit needed • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx04-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
Low Noise Amplifier • GaAs p-HEMT chip on board • No matching circuit needed • High Maximum input power(+25dBm) • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
Low Noise Amplifier • GaAs p-HEMT chip on board • No matching circuit needed • High Maximum input power(+25dBm) • High IP3 & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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RFHIC |
(LCLxx03-L) MCM LNA • Multichip Hybrid Module • GaAs p-HEMT & HBT chip on board • No matching circuit needed • High Gain & Low Noise • Single Supply Voltage (+5V) • Surface Mount Hybrid Type • Tape & Reel Packaging • Small Size, High Heatsink • Alumina Substrate • Pb Fr |
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