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PAN JIT 1N5 DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
1N5937B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
2
1N5938B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
3
1N5939B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
4
1N5942B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
5
1N5928B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
6
1N5940B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE
l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammabil
Datasheet
7
1N5349B

Pan Jit International Inc.
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE

• Built-in strain relief
• Glass passivated junction
• Low inductance
• Typical IR less than 5.0µA above 11V
• Plastic package has Underwriters Laboratory Flammability Classification 94V-O
• High temperature soldering : 260°C /10 seconds at terminals
Datasheet
8
1N5819

PAN JIT
SCHOTTKY BARRIER RECTIFIERS

• Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound.
• For use in low voltage,high frequency inverters ,free wheeling ,and polarity protection applications .
• Lead free in
Datasheet
9
1N5234B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
10
1N5397

PAN JIT
PLASTIC SILICON RECTIFIER

• Plastic package has Underwriters Laboratories Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound.
• Low leakage.
• Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA
• Case:
Datasheet
11
1N5264B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
12
1N5258B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
13
1N5254B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
14
1N5248B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
15
1N5246B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
16
1N5242B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
17
1N5240B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
18
1N5230B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
19
1N5223B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet
20
1N5222B

PAN JIT
SILICON ZENER DIODES

• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Met
Datasheet



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