PACELEADER INDUSTRIAL FM1 Hoja de datos

No.	parte #	Fabricante	Descripción
1	FM1100-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
2	FM160-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
3	FM150-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
4	FM120-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
5	FM130-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
6	FM140-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren
7	FM180-N	PACELEADER INDUSTRIAL	Chip Schottky Barrier Rectifier • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High curren