NXP Semiconductors SE9 Hoja de datos

No.	parte #	Fabricante	Descripción
1	SE97B	NXP Semiconductors	DDR memory module temp sensor SE97 old JEDEC specification no SMBus Timeout SMBus Timeout 25 ms to 35 ms 400 kHz VIL(max) = 0.3 × VDD; VIH(min) = 0.7 × VDD set to 0 frozen set to 0 yes set to 0 50 ns 1010 0010 0000 0001 Grade B 0.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 1.7 V to 3.6 V a
2	SE95	NXP Semiconductors	Ultra high accuracy digital temperature sensor and thermal Watchdog I Pin-for-pin replacement for industry standard LM75/LM75A I Speciﬁcation of a single part over supply voltage from 2.8 V to 5.5 V I Small 8-pin package types: SO8 and TSSOP8 (MSOP8) I I2C-bus interface to 400 kHz with up to 8 devices on the same bus
3	SE98	NXP Semiconductors	SO-DIMM SMBus/I2C-bus temperature sensor 2.1 General features I JEDEC (JC-42.4) SO-DIMM temperature sensor I Optimized for voltage range: 3.0 V to 3.6 V I Shutdown/Standby current: 8 µA (typ.) and 15 µA (max.) I 2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz I SMBus ALERT and
4	SE97	NXP Semiconductors	DDR memory module temp sensor 2.1 General features JEDEC (JC-42.4) TSE 2002B3 DIMM ± 0.5 °C (typ.) between 75 °C and 95 °C temperature sensor plus 256-byte serial EEPROM for Serial Presence Detect (SPD) Optimized for voltage range: 3.0 V to 3.6 V, but SPD can be read down to