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Matsushita |
LOW-FREQUENCY AMPLIFIER ing (98Sn-2Bi), Solder dip, Others ( )2 )6 *2 Chip mounting method Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** 3 Wire bonding method Thermalsonic bonding, Others ( )4 Wire material Au, Others ( )4 Mold material Epoxy, Others ( )5 |
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Matsushita |
General-Use Precision Timers ntry, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is g |
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Desde 2024. D4U Semiconductor.
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