No. | parte # | Fabricante | Descripción | Hoja de Datos |
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ETC |
CERAMIC SURGE ABSORBERS |
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NXP Semiconductors |
2.1 W/channel stereo class-D audio amplifier independent shutdown controls for each channel. The gain may be set at 6 dB, 12 dB, 18 dB or 24 dB with gain select pins G0 and G1. Improved immunity to noise and RF rectification is increased by high PSRR and differential circuit topology. Fast start |
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Jingdao Microelectronics |
2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER • Glass Passivated Chip Junction • Reverse Voltage - 100 to 1000 V • Forward Current - 2 A • High Surge Current Capability • Designed for Surface Mount Application PINNING PIN DESCRIPTION 1 Input Pin(~) 2 Input Pin(~) 3 Output Anode(+) 4 Output Cat |
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Peregrine Semiconductor |
SPDT Absorptive UltraCMOS DC 3.0GHz RF Switch 50Ω characteristic impedance Integrated 50Ω terminations High input IP3 > +55 dBm High isolation 64 dB at 1000 MHz Low insertion loss: typically 0.75 dB at 1000 MHz and 0.95 dB at 2000 MHz LV CMOS two-pin control Single +3 volt s |
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Freescale Semiconductor |
Integrated Silicon Pressure Sensor / Manifold Absolute Pressure Sensor |
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MIC |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ▪ Glass Passivated Chip Junction ▪ Reverse Voltage - 100 to 1000 V ▪ Forward Current - 2 A ▪ High Surge Current Capability ▪ Designed for Surface Mount Application MECHANICAL DATA ▪ Case: ABS/LBF ▪ Terminals: Solderable per MIL-STD-750, Method 2026 ▪ |
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MIC |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ▪ Glass Passivated Chip Junction ▪ Reverse Voltage - 100 to 1000 V ▪ Forward Current - 2 A ▪ High Surge Current Capability ▪ Designed for Surface Mount Application MECHANICAL DATA ▪ Case: ABS/LBF ▪ Terminals: Solderable per MIL-STD-750, Method 2026 ▪ |
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Thinki Semiconductor |
2.0 Ampere Surface Mount Miniature Bridge Rectifier Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260 /10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation High surge current capability Glass pa |
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Digitron Semiconductors |
TRANSIENT ABSORPTION ZENER DIODES |
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Sangdest Microelectronics |
SINGLE PHASE 2.0A MP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Glass passivated die construction Low forward voltage drop High current capability High surge current capability Designed for surface mount application Plastic material-UL flammability 94V-0 Mechanical Data: Case: SOPA-4, Molded plasti |
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Sangdest Microelectronics |
SINGLE PHASE 2.0A MP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Glass passivated die construction Low forward voltage drop High current capability High surge current capability Designed for surface mount application Plastic material-UL flammability 94V-0 Mechanical Data: Case: SOPA-4, Molded plasti |
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Microsemi Corporation |
(PIPxxx) TRANSIENT ABSORPTION ZENER |
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austriamicrosystems |
3D-Hall Encoder absolute linear up to 14-bit full scale resolution SPI and PWM output Wide magnetic input range 33 linearization points to achieve high precision Absolute linear position sensing up to 50 mm stroke Suppression of magnetic stray fields Low power operati |
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Jingdao Microelectronics |
2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER • Glass Passivated Chip Junction • Reverse Voltage - 100 to 1000 V • Forward Current - 2 A • High Surge Current Capability • Designed for Surface Mount Application PINNING PIN DESCRIPTION 1 Input Pin(~) 2 Input Pin(~) 3 Output Anode(+) 4 Output Cat |
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Jingdao Microelectronics |
2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER • Glass Passivated Chip Junction • Reverse Voltage - 100 to 1000 V • Forward Current - 2 A • High Surge Current Capability • Designed for Surface Mount Application PINNING PIN DESCRIPTION 1 Input Pin(~) 2 Input Pin(~) 3 Output Anode(+) 4 Output Cat |
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MIC |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ▪ Glass Passivated Chip Junction ▪ Reverse Voltage - 100 to 1000 V ▪ Forward Current - 2 A ▪ High Surge Current Capability ▪ Designed for Surface Mount Application MECHANICAL DATA ▪ Case: ABS/LBF ▪ Terminals: Solderable per MIL-STD-750, Method 2026 ▪ |
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MIC |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ▪ Glass Passivated Chip Junction ▪ Reverse Voltage - 100 to 1000 V ▪ Forward Current - 2 A ▪ High Surge Current Capability ▪ Designed for Surface Mount Application MECHANICAL DATA ▪ Case: ABS/LBF ▪ Terminals: Solderable per MIL-STD-750, Method 2026 ▪ |
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Cypress Semiconductor |
USB and Mass Storage Peripheral Controller |
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Cypress Semiconductor |
USB and Mass Storage Peripheral Controller |
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Digitron Semiconductors |
TRANSIENT ABSORPTION ZENER DIODES |
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