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MDD GS2 DataSheet

No. parte # Fabricante Descripción Hoja de Datos
1
GS2GBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
2
GS2ABF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
3
GS2BBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
4
GS2DBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
5
GS2JBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
6
GS2KBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet
7
GS2MBF

MDD
SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU diretives 0.051(1.30) 0.039(1.0) MECHANICAL DATA 0.216(5.5) 0.200(5.1) Case: JEDEC SMBF molded
Datasheet



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