Japan Aviation Electronics FI- Hoja de datos

No.	parte #	Fabricante	Descripción
1	FI-A20CH-10000	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
2	FI-AB20S-HF06	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
3	FI-A20M	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
4	FI-A20C	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
5	FI-S20S	Japan Aviation Electronics	Connector
6	FI-XC3-1-15000	Japan Aviation Electronics	LCD interface connector ■ Compatible with high-speed differential transmission and high-level impedance matching (90 to 100Ω) ■ Drastically improved grounding which is directly related to EMI characteristics. ■ 1.5mm connector height and 1mm height above the PCB thanks to b
7	FI-S08S	Japan Aviation Electronics	Connector
8	FI-S10S	Japan Aviation Electronics	Connector
9	FI-S15S	Japan Aviation Electronics	Connector
10	FI-A20H	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
11	FI-AC3-1-15000	Japan Aviation Electronics	Connector Board-to-cable application for high density packaging. • low-profile SMT type receptacle 1.0 mm high on • Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. • Precision impedance matching (100 ±
12	FI-S25S	Japan Aviation Electronics	Connector
13	FI-S30S	Japan Aviation Electronics	Connector
14	FI-R	Japan Aviation Electronics Industry	Connector for Internal Serial Transmission •0.5mm terminal pitch, 3.8mm connector, compact design with 21, 31, 41, and 51 positions. •Stable mating with large mating guides on the Plug. •Strong PCB retention with solder hold-downs on the Receptacle. •Impedance matching: 100 ohm. Ground reinfo