| No. | parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
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JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
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JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
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JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
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JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
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JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
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|
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|
JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
|
|
|
|
JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
|
|
|
|
JGD |
2.0 Amps. Surface Mount Super Fast Rectifiers * Glass passivated junction chip * For surface mounted application * Low profile package * Built-in strain relief * Ideal for automated placement * Easy pick and place * Superfast recovery time for high efficiency * High temperature soldering: 260℃/ |
|
|
|
|
JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
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|
|
|
JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
|
|
|
|
JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
|
|
|
|
JGD |
2.0 Amp. Surface Mount Glass Passivated Super Fast Rectifiers * For surface mounted application * Low Profile Package * Glass Passivated Chip Junction * High Temp Soldering: 260℃ for 10seconds at Terminals * Superfast Recovery Times A C B DE G F DIM. A B C D E F G SMAF INCHES MIN MAX 0.173 0.193 0.094 |
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Desde 2024. D4U Semiconductor.
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